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The wetting properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al 4.2 Cu 3.2 Zn 0.7 , Cu 5 Zn 8 , Cu 5 Zn 8 and AgZn 3 in the solder. The activation energy and the surface...
The Sn–8.5Zn–0.5Ag–0.1Al–xGa solders were investigated. The results showed that the microstructure of the solders were eutectic. The addition of Ga dramatically decreased the melting point of solders. Notably, the increase in Ga content of the solder improved the solderability, the tensile strength and reduced the ductility.
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