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Three-dimensional electromagnetic simulation models are often simplified and/or segmented in order to reduce the simulation time and memory requirements without sacrificing the accuracy of the results. This paper investigates the difference between full model and S-parameter cascaded based model of 3D stacked ICs with the presence of Through Silicon Vias. It is found that the simulation of the full...
In this work different physic based equivalent lumped element circuits models representing planar EBG structures are developed. Their results, in terms of evaluation of the lower and upper limits of the bandgap, are compared with a three dimensional simulation considered as reference. Guidelines for the use of these models for their use in planar EBG design are developed.
The modern telecommunication equipments consist of boards connected by thick backplanes where differential traces on different layers transmit high speed digital signals. These signals switch from different layers by means of plated through holes that, when not used, are stubs introducing dips on the insertion losses of the used traces. The paper presents an algorithm for modeling differential vias...
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