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As a consequence of increasing functional density and miniaturization in microelectronics new low-k and ultra-low-k materials are going to be increasingly used in Back-end of line (BEoL) layers of advanced CMOS technologies. These ongoing trends together with the transition to the use of TSVs for 3D-IC-integration cause novel challenges for reliability analysis and prediction of relevant electronics...
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Finite Element Models and DoE/RSM-approaches (Design of Experiments/Response Surface Methods) are more and more performed for optimizations at early phases of the product development process. This is especially the case for electronic components in the fields of RF (Radio Frequency), optoelectronics, high...
For the recent years, there is an outstanding progress in many microelectronic fields. One of the techniques which is nowadays widely used in microelectronics (and not only) is numerical prototyping. This technique has rapidly evolved because of the development of faster microprocessors and RAM modules which improve and speed up the calculations and optimization algorithms. The large development of...
Wafer level packaging (WLP) technologies are cost effective packaging solutions which are used increasingly. Second level reliability, i.e. mainly the thermo-mechanical reliability during thermal cycling, is a major concern of WLP. To avoid excessive solder straining, solder balls have been replaced by resilient interconnects, which can adopt the main part of the thermal mismatch deformation. One...
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