The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Lead-free reflow soldering techniques applying AuSn as well as SnAg electroplated bumps were chosen for the evaluation of the flip-chip-bonding process for X-ray pixel detectors. Both solders can be used in pick-and-place processes with a subsequent batch reflow suitable for high-volume production. AuSn solder was selected because of its fluxless bondability, good wettability, and self-alignment process...
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Finite Element Models and DoE/RSM-approaches (Design of Experiments/Response Surface Methods) are more and more performed for optimizations at early phases of the product development process. This is especially the case for electronic components in the fields of RF (Radio Frequency), optoelectronics, high...
The knowledge of deformation and fatigue behaviour is vital for understanding reliability problems and builds the basis for mechanical simulations, which quantify strains, stresses and even product life-times. The focus of this paper is the AuSn interconnect in the form of eutectic AuSn and fine pitch flip-chip interconnects consisting in this example of an Au-phase and a zetha-phase. In the fist...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.