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The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package...
The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Improving the efficiency of ultrasonic transducers plays an important role in the bonding process. However, the place of the tool on the transducer has affected transducer work efficiency. Therefore, to analyse the transducer and tool provided...
The current light-emitting diodes (LED) flip chip has the advantage of high speed electricity, small volume, good heat dissipation and high I/O density for modern display technology. Thermosonic bonding system for LED seeking to feature with lower temperature and lower pressure for industrial application is overwhelming. Development of such potential precision, fine pitch and with shorten ultrasonic...
The aim of this paper is to develop the detection system for present fast-developing LED (light emitted diode) photoelectric industry. To cope with the processing size of next generation dwindles, the gear of the inspection equipment in ultra precision and fast inspection specifications will become one of the important research keys. This paper presents a machine vision to inspect LED microstructure...
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