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A contact process between large-scale integration (LSI) pads and test probes at low contact force is a key to developing a probe card with smaller pitch and higher pin count. In this paper, we report on the characteristics of low-force contact methods on Cu electrodes. One is the fritting process, in which an electric breakdown is utilized to break the surface oxide, and the other is the heating treatment...
We report on the breakdown of thin native oxide film formed on aluminum electrodes contacting metal probes at the contact force smaller than 0.1 mN when the surface aluminum oxide is difficult to break mechanically. The contact method with low contact force on aluminum electrodes is required for test probing of LSI for the next generation. A gold wire was used as a contact probe on aluminum electrode...
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