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Due to increases in the complexity of processes involved in semiconductor manufacturing, increasingly high inspection costs associated with defective wafers has become a critical concern of modern manufacturers. More importantly, because of high-dimensional wafer bin maps (WBMs), it is difficult to capture the variations of each dimension via traditional pattern recognition or classification methods...
Semiconductor manufacturing involves lengthy and complex processes, and hence is capital intensive. Companies compete with each other by continuously employing new technologies, increasing yield, and reducing costs. Yield improvement is increasingly important as advanced fabrication technologies are complicated and interrelated. In particular, wafer bin maps (WBM) that present specific failure patterns...
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