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In this research, a fundamental study is conducted to identify the materials and processes for producing bonding/barrier composites on Bi2Te3 for high temperature thermoelectric applications. Pd, Ni, Ni/Au, Ag, and Ti/Au were deposited and evaluated using scanning electron microscope (SEM) and energy dispersive X-ray (EDX). A thermal evaporated, 100nm Ti/100nm Au composite gave the most promising.
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