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In wafer fabrication, Fluorine (F) contamination may cause F-induced corrosion and defects on microchip Al bondpad, resulting in bondpad discoloration or non-stick on pad (NSOP). In the previous paper [1], the authors studied the F-induced corrosion and defects, characterized the composition of the “flower-like” defects and determined the binding energy of Al fluoride [AlF6]3- using X-ray Photoelectron...
In this paper, a novel sample preparation method for obtaining high- resolution SEM profile is proposed. Both Sela fine cleave and FIB slice techniques have been used for SEM sample preparation. Using this new method, high-resolution 90 degrees SEM micrographs are provided. It has been applied in failure analysis to check Via gouging information without any charging problem, which helps us to reduce...
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