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A Sn oxide layer on the surface of Sn solder balls plays an important role in the semiconductor packaging industry. This paper shows a comprehensive analysis of the Sn oxide layer by XPS depth profiles. The distribution of Sn with different oxidation states can be derived from curves fitting Sn3d5/2 peaks. Moreover, the oxide layer thicknesses obtained from XPS demonstrate a linear correlation with...
In this study, failure analysis was conducted to investigate the root cause of Ti/Ni/Ag film peeling from Si wafer surface. The adhesion strength of Ti/Ni/Ag film on Si was quantitatively measured by 4 Point Bending method (4PB), where a novel delamination initiation method was introduced to significantly reduce the energy barrier for the delamination initiation. The possible contamination elements...
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