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Al fluoride oxide on microchip Al bondpads may cause non-stick on pad (NSOP) problem during bonding process. In this study, a failure mechanism to form Al fluoride oxide-AlxOyFz has been proposed. Based on the failure mechanism, F contamination on Al bondpads, it will chemically react with Al and 3 form Al-F complex compound, such as [AlF6]3-. [AlF6]3- formed may become an anode and further chemical...
A bond pad failure mechanism of galvanic corrosion was studied. Analysis results showed that over-etch process, EKC and DI water over cleaning revealed more pitting with Cu seed due to galvanic corrosion. To control and eliminate galvanic corrosion, the etch recipe was optimized and etch time was reduced about 15% to prevent damaging the native oxide. EKC cleaning time was remaining unchanged in order...
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