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A new planar-type body-connected FinFET structure produced by the isolation-last self-align process is demonstrated and characterized by using three-dimensional (3-D) numerical simulations. The new process step first defines the gate region and then the active region, thus it can achieve fully self-alignment undoubtedly. Besides, due to the isolation-last process (ILP), an additional body region (ABR)...
This paper for the first time presents a performance comparison between junction and junctionless thin-film transistors (TFTs) by using TCAD simulations. Note that the DIBL and S.S. of a junctionless TFT (JLTFT) are larger and higher, respectively, than those of its junction TFT (JTFT) counterpart. Although the JLTFT gets a higher current drive based on the same Vov as compared with the JTFT, its...
In this paper, we propose a junctionless vertical MOSFET (JLVMOS) based on bulk-Si wafer. According to the numerical simulations, the proposed JLVMOS can get a steep subthreshold swing (S. Swing), reduced DIBL, and higher ION/IOFF ratio, in comparison to a junctionless planar SOI MOSFET. This is because the vertical double-gate (DG) structure truly helps reduce the short-channel effects (SCEs). More...
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