Search results for: E.H. Wong
Microelectronics Reliability > 2017 > 79 > C > 206-220
International Journal of Adhesion and Adhesives > 2017 > 78 > C > 4-12
International Journal of Fatigue > 2017 > 98 > C > 167-175
Microelectronics Reliability > 2016 > 67 > C > 135-142
International Journal of Cardiology > 2016 > 223 > C > 665-668
Microelectronics Reliability > 2016 > 65 > C > 318-326
Microelectronics Reliability > 2016 > 59 > C > 1-12
International Journal of Adhesion and Adhesives > 2016 > 65 > Complete > 19-27
Composite Structures > 2015 > 134 > C > 226-236
Microelectronics Reliability > 2015 > 55 > 11 > 2331-2335
Composite Structures > 2015 > 125 > Complete > 72-80
Microelectronics Reliability > 2015 > 55 > 3-4 > 588-595
International Journal of Fatigue > 2014 > 68 > Complete > 186-194
International Journal of Fatigue > 2014 > 59 > Complete > 43-49
Materials & Design > 2014 > 54 > C > 632-643
IEEE Transactions on Electronics Packaging Manufacturing > 2010 > 33 > 2 > 84 - 90
Microelectronics Reliability > 2009 > 49 > 8 > 916-923
International Journal of Mechanical Sciences > 2009 > 51 > 2 > 152-158
Microelectronics Reliability > 2009 > 49 > 2 > 139-149