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A bottom-inlet-type micro-electro-mechanical system acoustic sensor based on two polyimide/a-Si sacrificial layers is presented. A diaphragm was adapted to be on the top side of the sacrificial layers, showing the bottom-inlet structure for the package, which has the sensitivity of more than 3 dB compared with that of the top-inlet type. Also, the fundamental CMOS process implemented with Al electrodes...
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