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This study reports the design architecture to embed piezoresistive pressure sensor into accelerometer (PinG sensor) on a single chip by using the cavity-SOI process. The monolithic sensing chip can find various applications such as tire pressure monitoring system (TPMS), etc. The merits of the presented design includes significant chip size reduction by integrating the diaphragm of pressure sensor...
This study presents a novel single proof-mass 3-axis capacitive-type accelerometer design consisting of poly-Si rib-proofmass, springs, high-aspect-ratio in-plane sensing electrodes, and plate-type out-of-plane sensing electrodes. This single proof-mass accelerometer design has three merits to increase the sensitivity, (1) large area plate-type out-of-plane gap-closing sensing electrodes with differential...
This study presents the development of a foundry available process scheme for MEMS devices. Such MEMS process scheme enables integration of various MEMS sensors with Pirani gauge. In applications, this study has employed such bulk Si with embedded poly plug process scheme to demonstrate various MEMS devices of different vacuum requirement, including resonators, accelerometer, gyroscope, and magnetometers...
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