The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A comparative study has been performed to investigate the processing effects on via extrusion for through-silicon vias (TSVs) in 3-D integration. This paper is focused on three TSV structures with identical geometry but different processing conditions. The thermomechanical behavior, microstructure, via extrusion, and additives incorporated during electroplating are examined by various techniques,...
Thin crystalline silicon solar cells are of interest due to significant material cost reduction and potentially high conversion efficiency. We have previously demonstrated a patented, novel exfoliation technology capable of producing large area (156×156 mm) 25 µm thin flexible mono c-Si cells with high efficiencies. In this paper we address the mechanical strength and handling requirements of these...
Thermal stresses in TSV structures have been measured using micro-Raman spectroscopy and precision wafer curvature technique as a function of temperature and during thermal cycling. The results were verified by finite element analysis (FEA) to characterize the thermal stress behavior of the TSV structures. A nonlinear stress relaxation was observed during initial heating and no preferred grain orientation...
In this work, experimental measurements and numerical analysis of the thermal stresses in TSV structures are presented. The stresses are measured using the micro-Raman spectroscopy and the precision bending beam technique. Together, the two methods provide a complementary approach for characterizing thermomechanical behaviors of the TSV structures. The effect of plasticity on the stresses is discussed,...
Interband cascade lasers (ICLs) are considered to be a very promising candidate for covering the mid-infrared wavelength range between 3 μm and 4 μm with just one type of semiconductor laser. Our contribution strengthens this thesis in terms of electro-optical results obtained from broad area and ridge waveguide ICL devices. A set of six ICLs with varied widths of the optically active InAs QWs shows...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.