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The electromigration (EM) behavior of 300 μm Sn-3.0Ag-0.5Cu solder bumps on Au/Ni-P substrate metallization in flip chip package was investigated at 150°C with a current density of 5×103 A/cm2. After reflowing for three times, the massive spalling of original intermetallic compound (IMC) of (Cu,Ni)6Sn5 was observed on the chip side. After aging and EM at 150°C for 200 h, the initial intermetallic...
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