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The ultra-thin dielectric substrate was obtained by precision grinding and lapping/polishing. In the precision grinding, the substrate was thinned until 50 μm in thickness using fine-grained diamond wheels and a polishing pad. The substrates in the lapping and polishing were thinned to 17 μm in thickness with good flatness. The good flatness was produced by hard polishing pad made of polyvinyl chloride...
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