The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The temperature and velocity distribution during the transient melting phase change in Sn-0.7Cu solder alloy has been modelled using finite element method. The simulation of melting front dynamics has been performed by an Eulerian method, commonly known as enthalpy method. CALPHAD technique is utilized for the computation of enthalpy of the solder material. The flow in the liquid regime of the solder...
Finite element method is utilized to solve the diffusion equation and model the diffusion driven growth of a pre-existing spherical gas bubble in molten tin at the solder/substrate interface for reflow time of 120 s and temperature of 250 °C. The gibbs free energy change required for determining the equilibrium concentration at liquid solder/gas bubble boundary was calculated using the thermodynamic...
With the advent of lead-free soldering electronic packaging industry, there are growing concerns regarding the problems of voids in lead-free solder joints. Many researchers are eager to understand the growth, evolution and control factors of bubbles. Due to the restrictions in test conditions imposed by high temperature and opacity of soldering, one cannot directly observe and analyze the behaviour...
With the advent of lead-free soldering electronic packaging industry, there are growing concerns regarding the problems of voids in lead-free solder joints. Many researchers are eager to understand the growth, evolution and control factors of bubbles. Due to the restrictions in test conditions imposed by high temperature and opacity of soldering, one cannot directly observe and analyze the behaviour...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.