The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Large diameter (50-70 mm) wire array z pinches are fielded on the refurbished Z machine to generate 1-10 keV K-shell x-ray radiation. Imploding with velocities approaching 100 cm/μs, these loads create large dL/dt which generates a high voltage, stresses the convolute, and leads to current loss. High velocities are required to reach the few-keV electron temperatures required to strip moderate-atomic-number...
Summary form only given. Fast z-pinches produce intense K-shell radiation from wire arrays and for Cu arrays these photon energies can exceed 8 keV Experimental investigations of pinches on ZR using Cu arrays have already begun and more are planned for the near future. However to produce significant K-Shell emissions from moderately high atomic number plasmas such as Cu, they must be rapidly ionized...
Summary form only given. Copper wire arrays have previously been fielded in large diameter (up to 70 mm) nested configurations on the 20 MA Z machine, with average Cu K-shell (8.4 keV) yields of 20 kJ typical. More recently, Cu K-shell source development studies have been performed on the refurbished Z machine, which in initial commissioning shots has produced just over 20 MA current in these loads...
Summary form only given. K-shell X-rays have been studied with various materials at the 20-MA (pre-refurbished) Z accelerator. This paper presents results obtained for the ablation dynamics and stagnation physics of single and nested copper z-pinches with varying initial load diameters. Monochromatic imaging and shadowgraphy provide detailed information regarding the ablation of the wires and the...
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnect. However, in many package styles, such as BGAs (ball grid arrays), LGAs (land grid arrays), MLFs (micro lead frame) and QFNs (quad flat no-lead), the Cu trace emanating from the solder pad may be the weakest failure site, especially if the solder joint is copper-defined rather than...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.