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A novel pretreatment of plasma combined self-assembled monolayer (PcSAM) was proposed to improve surface properties of electroplated Cu for low temperature Cu–Sn bonding in 3D integration. Measurement results revealed that self-assemble monolayer (SAM) would be easier absorbed on plasma-activated Cu surface and protect the clean surface from re-oxidation when storage. The absorbed SAM layer could...
The pretreatment with Ar mixed 5% H2 plasma was applied to improve surface properties of electroplated Cu for low temperature Cu-Sn bonding in 3D interconnection. Measurement results revealed that the Ar(5% H2) plasma effectively increased the surface activity by reducing oxygen content of the Cu surface. Lower surface roughness obtained by optimizing the pretreatment condition could help to suppress...
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