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In this paper, we propose a feasible and prospective method to prepare copper-coated ceramic substrate by using nano thermo-compression bonding technology. Nanoporous copper (NPC) can be prepared by dealloying of Cu-Zn alloy system in L-tartaric acid solution. By controlling the concentration of L-tartaric acid solution and dealloying temperature, NPC presents good homogeneity and open bi-continuous...
This paper proposed a yellow YAG:Ce3+ based PiG for high-power white light-emitting diode (WLED) packaging, and its thermal reliability was systematically investigated. The PiG was fabricated by introducing yellow YAG:Ce3+ phosphor embedded with borosilicate glass through screen-printing and low-temperature sintering. The thermal aging tests of PiG were carried out and compared with the conventional...
A uniform, reproducible, and whole inorganic hermetic packaging technology using localized induction heating and its application to deep ultraviolet light-emitting diode (DUV-LED) packaging with glass cap have been proposed and demonstrated. By localized induction heating and inorganic packaging materials, the DUV-LED was rapidly packaged, which eliminates thermal damages during packaging process...
Thermal resistance model of packaged light-emitting diode (LED) samples was proposed to investigate the thermal performances of different ceramic substrates. The thermal resistances of four metallized ceramic substrates were measured by using thermal transient tester. Consequently, the thermal resistances of TFC-Al2O3, DPC-Al2O3, DBC-Al2O3 and DPC-AlN are 8.09 K/W, 7.05 K/W, 4.78 K/W, and 1.57 K/W,...
Polycrystalline sample of Ba4Gd2Fe2Nb8O30 ceramics were prepared by a high temperature solid-state reaction technique. The structure and dielectric properties as well as the behavior of ferroelectric phase transition have been investigated. The dielectric spectra are characterized in wide frequency (40 Hz-1 MHz) and temperature (25degC-600degC). At 1MHz, the room temperature dielectric constant of...
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