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In this paper, a vertical probe card consisting of a probe head and a multi-layer ceramic (MLC) board is designed to test wafer-level mobile application processor (AP) chips under LPDDR4 channel specifications. Compared with previously designed probe cards, the newly developed probe card improves signal and power integrity to guarantee the wafer-level AP chips to be operated at 3.2 Gbps speed. In...
In this paper, a vertical probe card design for wafer-level mobile application processor (AP) chip test is proposed under LPDDR4 channel specifications. The probe card consists of a probe head and a multi-layer ceramic (MLC) board, and it is designed to have signal and power integrity to guarantee the wafer-level AP chips to be operated at 3.2 Gbps of speed under 1.1 V of supply voltage. We proposed...
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