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Solder joint integrity is recognized as a key issue in the reliability of electronic devices. In the past decades, SnAgCu eutectic based solders are replacing SnPb eutectic solders in the electronics industry. Although the Pb-free solder is usually regarded as having a higher melting temperature compared with traditional Pb-Sn eutectic solder, solder joints were generally operated at a high homologous...
Solder joint integrity is recognized as a key issue in the reliability of electronic devices. In the past decades, SnAgCu eutectic based solders are replacing SnPb eutectic solders in the electronics industry. Although the Pb-free solder is usually regarded as having a higher melting temperature compared with traditional Pb-Sn eutectic solder, solder joints were generally operated at a high homologous...
Lead-free solders are replacing traditional lead-rich solders in the electronic industry. In the present study, the fatigue crack growth behavior of Sn-Ag-Cu solder interconnect has been investigated. An approach based on phase transformation theory and fracture mechanics was applied to predict fatigue crack propagation in a Sn-Ag-Cu interconnect, which consists of solder and intermetallic layers...
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