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The low-k dielectric materials in wafer fabrication are widely used. The current advanced mechanical dicing is not able to meet the requirement of low-k technology, since the low-k materials are harder and brittle. Laser dicing is developed for low-k wafer dicing. There are various laser dicing techniques in the market. Depending on the wafer thickness, laser dicing can either be a though cut or a...
Ethyl cellulous (EC) fibrous films were fabricated via electrospinning from solutions with various DMF/acetone volume ratios and the hydrophobic properties were investigated. The morphology of electrospun EC films reveals a conversion from beads to uniform nanofibers by decreasing the DMF/acetone ratio. Pure DMF solution leads to bead structures while uniform nanofibers can be obtained from DMF/acetone...
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