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Electrostatic discharge (ESD) robustness of the Sub-10 nm diameter gate-all-around nanowire field-effect transistor (NW FET) was characterized and compared with sub 65nm MOS devices and FinFETs. Failure mechanisms of NW FETs subject to ESD stresses are investigated by DC current-voltage measurements carried out before and after stressing the devices with ESD equivalent pulses generated from the transmission...
The failure mechanisms of silicon nanowire field-effect transistors subject to electrostatic discharge (ESD) stresses are investigated using electrical characterization and microscopy analysis. Current-voltage measurements are carried out before and after the devices are stressed with ESD equivalent pulses generated from the transmission line pulsing (TLP) tester. Depending on the TLP stress level,...
La-doped HfSiO samples show lower threshold voltage (Vth) and gate current (Igate), which is attributed to dipole formation at the high-k/SiO2 interface. At low and intermediate field stress, La-doped devices exhibit better immunity to positive bias temperature instability (PBTI) due to their lower charge trapping efficiency than the control HfSiO, which mainly results from a dipole-induced greater...
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