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Brominated epoxy resin (BER) composites containing various amounts of SBA-15 and SBA-16 types mesoporous silicas were prepared through the thermal curing with 3-methyl-tetrahydrophthalic anhydride, and their morphologies, dielectric constants (κ), thermal properties and mechanical properties were studied. The investigation suggested that the dielectric constant could be reduced from 4.09 of the pure...
A series of novel low-dielectric constant (low-κ) polyimide (PI) composite films containing the SBA-15 or the SBA-16-type mesoporous silica were successfully prepared via in situ polymerization and following thermal imidization. Their morphologies, dielectric constants, and thermal and dynamic mechanical properties were investigated. It is found that the dielectric constants of the composite films...
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