The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Cost remains a key factor for implementation of Through Silicon Via (TSV) in high-volume manufacturing. As compared to via-first and via-middle TSV, via-last (from wafer back-side) TSV possesses the advantage of a more simple process flow and more flexibility in integration for more varied applications. Previously, a cost model analysis for Through-Silicon-Interposer (TSI) using via-first TSV has...
Through-silicon via (TSV) technology has been widely investigated recently for 3-D electronic packaging integration. Reducing TSV wafer warpage is one of the most challenging concerns for successfully subsequent processes. In this paper, a wafer-level warpage modeling methodology has been developed by the finite element analysis method using an equivalent material model. The developed modeling methodology...
In the current 3D integration technology, the control of wafer warp is needed to ensure uniform photolithography, good bonding areas and other major processes that requires flat wafer surface. In this paper, we found out that the wafer warpage was increased with increasing TSV density. The highest wafer warpage was observed after Cu annealing base on step by step warpage monitor. Wafer warpage reduction...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.