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This paper propose to develop the combined neural networks and transfer functions (neuro-TF) for parametric modeling of millimeter-wave passive components. Artificial neural networks (ANN) techniques are recognized as a powerful tool for modeling the EM behavior of microwave components. In this paper, we train the ANN to map geometrical variables onto coefficients of transfer functions. The model...
Control of the capillary driven underfill flow process is a very important problem in flip chip technology in electronics packaging. The challenge here is to uniformly distribute fluids in the gap, which is composed of the chip and substrate and solder bumps. In this paper, we first present a conceptual model of the flow behavior of underfill materials, which has four stages, leading to the finding...
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