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A new wafer bonding approach for 3-D packaging is designed fabricated and tested. We can summarize device market trend in next few words like Low cost, small form factor, integration, high performance, etc. During the last decades, 3-D wafer level packaging (3-D WLP) is highlighted as the next generation packaging method for satisfying market needs. 3-D WLP method has many advantages like low cost...
System in package (SiP) has the ability to integrate other components, such as passive component and antenna, into a single package to realize complete system functions. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping...
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