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A hybrid scattering matrix method (SMM) and a modal decomposition technique for analysis of signal traces in the power distribution network of an electronic package are presented in this paper. Applying the modal decomposition of the waves propagating inside the power-ground (P-G) planes and the signal traces, the electromagnetic fields can be decomposed into the parallel-plate mode and the transmission-line...
An efficient hybrid modeling method is presented for analysis of the surface-mount technology (SMT) decoupling capacitor placement in the power distribution network (PDN) of an electronic package. The PDN includes the multilayered power-ground (P-G) planes, the P-G vias, and the decoupling capacitors to provide a low-impedance path between the printed circuit board and the die. The SMT decoupling...
This paper presents a two-dimensional full-wave method for efficient analysis of power integrity and electromagnetic interference (EMI) of high-speed electronic packages. The power/ground planes in electronic packages form a multilayered parallel-plate structure due to the practice of using whole metal plate as power or ground planes. Each pair of power/ground plane is suitable to be modeled by a...
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