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In this paper, a TGV interposer based wafer level packaging for inertial MEMS devices is presented. For the TGV interposer, there is a redistribution layer of Al wiring on each side, which are electrically connected with Al metalized TGV. Being as a capping wafer, it's bonded to a MEMS accelerometer wafer based on bulk silicon process with a patterned benzocyclobutene(BCB) layer to achieve wafer level...
In this paper, a novel petaloid hollow Cu interconnection for interposer is presented, its stress can be released by free ends face to hollow Cu interconnection center, and its fabrication process for Si substrate and glass substrate are also presented. Stress distribution and Max. stress of interposer with petaloid hollow Cu interconnection comparison with normal TSV is simulated and analyzed by...
In this paper, a simplified process for TGV interposer is presented for RF applications. Sand blasting method and thinning/polishing process is utilized to form TGVs on Glass wafer. TGV interposer metallization of is realized with Al sputtering followed by wet chemical etching. Based on the process, TGV interposer is fabricated and the TGV sample measures about 361µm in the diameter at the front side,...
For least squares support vector machine (LS-SVM) classifier to the loss of sparseness and generalization, a pruning modeling method is proposed based on Quadratic Renyi entropy. The kernel principal component is adopted for data pre-processing, and the training set is divided randomly. Then the concept of quadratic Renyi entropy is introduced as the basis of training and pruning in LS-SVM classifier...
As the large number of feature attributes in Case-based reasoning system (CBR) brings a huge information redundancy which reduces the retrieval efficiency, a novel reduction method based on Water-Filling is proposed to remove those unnecessary attributes. In the method, the importance of each attribute could be calculated by utilizing the ratio of the standard deviation and the mean value of each...
A water drop was released from 13.6mm above a glass or paraffin surface. The images were recorded sequentially (the silhouette and 58° top view) from the moment that the droplet impacted solid surface until it reached equilibrium. The full water droplet profile during spreading was obtained from the digitized images. Digitized droplets were then used to detail the dynamic impact and spreading behaviors,...
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