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With increasing power demands in modern SoCs, macros are designed to operate in multiple low power modes depending upon the voltage value of each supply. Power Aware simulations have been recently in use for simulating and verifying these low power features at the RTL level. The supplies inside PA models of IOs are modeled as ‘reg’ type and can only carry logic values 0/1. These logic values does...
3D integration technology has the potential to enhance IC performance, improve functionality and lessen wiring of ICs. However, it poses several challenges, where the key challenge is heat generation from internal active layers due to power dissipation. To mitigate this challenge, thermal aware design has become a necessity. Towards thermal aware design, this paper proposes a two stage design technique...
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