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The authors discuss the comparison of aramid (Technora by Teijin)/epoxy and glass/epoxy composites for multi-layer PWB (Printed Wiring Boards) in relation to blind via laser drilling. A CO 2 laser with a maximum attainable power of 100W is used. The spot diameter is 0.3mm. The layer build up has a thickness of 0.3mm with the outer copper etched. The blind vias are formed by laser irradiation...
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