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Nowadays, the microelectronics industry broadly uses the flipchip technology to enhance the packaging density. However, the small size and the unique geometry of the flip-chip solder joints induce the electromigration (EM) reliability issue. In this study, a Pb-free solder joints (SAC1205) was EM tested by a current of 7.5×103 A/cm2. During the tests, a three-dimensional (3D) X-ray laminography method...
Multi-signal compressed sensing with total variation (MTV-CS) is developed for tomographic inversion of building structure. Incorporating with prior information of the building object, some particularly aligned pixels are combined via the minimization of the object function, as indicated by total variation regularization. A numerical simulation of scattering and SAR imaging of the buildings and the...
In this paper, a frequency selective structure (FSS) using stacked strip lines is presented to exhibit bandpass response with sharp roll-off characteristic. In order to obtain the desirable transmission poles and zeros, two shorted via holes are introduced in reasonable locations of each strip line. The design concept is briefly described and parametric studies are carried out to explain the operating...
Contextual information is proven helpful to recommender system. And context-aware recommender system(CARS) has been applied in various applications. To improve the accuracy of context-aware recommendation and make recommender application development easier, we develop a lightweight software framework named ConRec, which introduces a dynamic context oriented approach to extend traditional reduction...
The traffic scenario consists of the road scenario and traffic elements. The original image sequences can be captured by a moving platform equipped with camera by driving along the road. In this paper, an approach based on augmented reality is proposed that supplements new elements (traffic cones, obstacles, etc.) into those image sequences. We model the traffic scenario in the 3D space of the scene,...
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