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In this study, board level drop shock and TC reliabilities in terms of solder materials and UBM (under bump metallurgy) structures have been evaluated to suggest optimal structures of WLP (wafer level packaging) with the large die, high pin counts for mobile application. Test vehicles of WLP have been designed with 5.6??5.6 mm die size, 340 um thickness (including backside protection film), 14??14...
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