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Two embedded micro-wafer-level packages (EMWLP) with 1) laterally placed and 2) vertically stacked thin dies are designed and developed. Three-dimensional stacking of thin dies is demonstrated as progressive miniaturization driver for multi-chip EMWLP. Both the developed packages have dimensions of 10 mm × 10 mm × 0.4 mm and solder ball pitch of 0.4 mm. As part of the development several key processes...
Die shift problem that arises during the wafer molding process in embedded micro wafer level package fabrication was systematically analyzed and solution strategies were developed. A methodology to measure die shift was developed and applied to create maps of die shift on an 8 inch wafer. A total of 256 dies were embedded in an 8 inch mold compound wafer using compression molding. Thermal and cure...
Developments of ultra fine pitch and high density solder microbumps and assembly process for low cost 3D stacking technologies are discussed in this paper. The solder microbumps developed in this work consist of Cu and Sn, which are electroplated in sequential with total thickness of 10 mum; The under bump metallurgy (UBM) pads used here is electroless plated nickel and immersion gold (ENIG) with...
High density three dimensional (3D) interconnects formed by high aspect ratio through silicon vias (TSVs) and fine pitch solder microbumps are presented in this paper. The aspect ratio of the TSV is larger than 10 and filled with Cu without voids; there are electrical nickel and immersion gold (ENIG) pads on top of the TSV as under bump metallurgy (UBM) layer. On the Si chip, Cu/Sn solder microbumps...
Two embedded micro wafer level packages (EMWLP) with (1) laterally placed and (2) vertically stacked thin dies are designed and developed. 3D stacking of thin dies is illustrated as progressive miniaturization driver for multi-chip EMWLP. Both the developed packages have dimensions of 10 mm times 10 mm times 0.4 mm and solder ball pitch of 0.4 mm. As part of the work several key processes like thin...
Multi layered metal-insulator-metal (MIM) structures with BiFeO3 (BFO) and Ba0.25Sr0.75TiO3 (BST) thin films were fabricated by chemical solution deposition. Crystalline structure of BFO was recognized as rhombohedral and was not influenced by the BST intermediate layer. Compared to the homogenous BFO, in the heterostructures, coercivity increased and saturation magnetization reduced. BST intermediate...
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