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Solder joint crack in thermal cycling on board (TCoB) for surface mount devices (SMD) is becoming more stringent in semiconductor market. Current TCoB literature mainly focuses on Finite Element Analysis simulation with ANSYS software to identify the most sensitive parameters affecting TCoB performance and estimating the solder fatigue life. By a given Driver Mosfet Power QFN, this paper is focusing...
Through silicon via is an essential element for three dimension integration. Excessive stress have potential effects on the reliability of the structure. One concern is the peeling problem of SiO2 layer. It was found that it is caused by the electroplated copper during later solder reflow process. We also found that it is possible to ameliorate the peeling problem by increasing the compressive stress...
Through silicon via is an essential element for three dimension integration. Excessive stress have potential effects on the reliability of the structure. One concern is the peeling problem of SiO2 layer. It was found that it is caused by the electroplated copper during later solder reflow process. We also found that it is possible to ameliorate the peeling problem by increasing the compressive stress...
A split-gate (SG) flash memory cell has been embedded in a 65nm ground-rule high performance (HP) CMOS logic process with copper low K interconnects. A gate spacer processing sequence self-aligned (SA) process provides a reliability-robust cell and high degree of modularity with one extra mask to form the SG structure. The proposed cell is optimized for minimum module area overhead, high endurance...
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