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Band-pass-filters (BPF) are critical components in the RF modules. Conventional discrete component solutions, like those from discrete SMDs or LTCC (Low temperature co-fired ceramic) technology. Typically, these passive components consume 60%–70% of the footprint area. As miniaturization is becoming a trend for cost-reduction of wireless products, there is a need to make these devices in smaller form-factors...
Band-pass-filters (BPF) are critical components in the RF modules. Conventional discrete component solutions, like those from discrete SMDs or LTCC (Low temperature co-fired ceramic) technology. Typically, these passive components consume 60%–70% of the footprint area. As miniaturization is becoming a trend for cost-reduction of wireless products, there is a need to make these devices in smaller form-factors...
Nowadays, inductors are prone to be integrated into chip surface for miniaturization considerations in some RF applications, but high Q factor cannot be achieved because of the lossy CMOS Si substrate. In this study, single layer spiral coils of one turn were fabricated on Si wafers with high and low resistivity via redistribution process and a polyimide layer were added on the wafer with low resistivity...
We have used terahertz spectroscopy to measure the conductivity and time-resolved photoconductivity of a range of semiconducting nanostructures. This article focuses on our recent terahertz conductivity studies on semiconductor nanowires and single walled carbon nanotubes.
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