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The design of printed circuit board (PCB) pad for SMP connector is presented. A detailed design and parameterization study are performed using HFSS, a commercial finite element tool. The PCB pad for the vertical SMP connector and surface mounted SMP connector are optimized. According to the simulation result, the return loss and insertion loss for SMP-to-microstrip transitions are better than 26 dB...
This paper presents the simulation results for a new dual-probe structure using multilayer PCB technology that is capable of performing power splitting across the whole of w-band frequency band from 75 GHz to 110 GHz. Existing single probe waveguide-to-microstrip transition design was employed for the new multilayered dual-probe structure, which proved to be effective in waveguide-to-microstip transition...
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