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The package-on-package (PoP) as one of the 3D packaging solutions has been rapidly used in portable products due to its flexibility and testability, but the PoP packaging industry encounters more manufacturability and reliability related issues during new PoP development. To solve the issues, the methodologies of design for manufacturability (DFM) and design for reliability (DFR) are widely used in...
The needs to integrate devices into portable products with smaller form factor and more functionality have fueled enormous growth of 3D packaging technology. The package-on-package (PoP) is one of the 3D packaging solutions, by which the packaging and assembly houses can achieve a lower cost, faster turn benefits and testing prior to assembly. PoP is a complicated system with multi-layered structure,...
The package technology has matured significantly over the past several years, shifting from conventional components and direct board level assembly to chip or package level system integration. Two major commonly used approaches are System-on-Chip (SoC) and System-in-Package (SiP). Package-on-Package (PoP) that integrates logic die in the bottom package and memory die in the top package into a single...
The chip-on-glass (COG) technique using anisotropic conductive film (ACF) has been developed for liquid crystal display (LCD) panels with excellent resolution and high quality for several years. However, many serious manufacturability and reliability issues were observed from previous studies. In those, delamination occurring at the ACF interface is one of the common concerns. Few works presented...
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