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Wettability between the molten Sn and AlCoCrCuxFeNi (x = 0, 0.5, 1, 1.5) high-entropy alloy (HEA) substrates was studied by sessile drop technique at 823 K. The final contact angle decreased with the increase of Cu content in the AlCoCrFeNi HEA. Additional Cu could not only change surface structure of AlCoCrFeNi HEA but also effect on the interfacial reaction between the molten Sn and AlCoCrCuxFeNi...
The wetting behavior and the interfacial characteristics of the molten Sn on a CuFeNiCoCr high-entropy alloy (HEA) substrate were investigated by the sessile drop method. Oxidation of the CuCoNiFeCr HEA surface inhibited the interaction between the molten Sn and the CuCoNiFeCr HEA substrate, leading to a very poor wetting at 573K, 623K and 673K. However, the equilibrium contact angle decreased monotonously...
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