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QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages. Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced...
SIM cards have been more and more widely used and the failure of packaging becomes a remarkable issue. In this paper, effects of die thickness and layout, material properties and packaging process parameters on the stress of dies were analyzed based on finite element simulation. The whole simulation includes two main packaging processes: cooling after die attach and molding process. The warpage of...
The solder joints reliability of electronic packages during board level drop impact is a great concern for semiconductor manufacturers. Many researchers have adopted numerical simulation to investigate the drop performance of electronic package because it is fast and cost-effective. However, the solder balls, which are recognized as vital parts for the integrity of solder joints and the overall function...
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