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Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential...
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential...
Grain boundaries and/or solder channels between the neighboring Cu6Sn5 grains at the Sn/Cu interface have long been thought to have the negative effects on the interconnect reliability of the solder joints. In this paper, the single-crystal Cu6Sn5 seed is synthesized and then assembled on Cu pad via 1 min reflow at 250 °C. By combining the EBSD analysis, the traditional polycrystalline Cu6Sn5 monolayer,...
Area array soldering is one of the main interconnection technologies for the inter graded circuit (IC) packaging and assembly. The typical area array soldering processes include some conventional heating methods, such as forced convective hot-air reflow and infrared reflow, which have the merit of high throughput in mass industrial production and, however, sometimes may cause the warpage of components...
Induction heating reflow method, which can achieve the solder bumping and interconnecting process in a simple way, was studied to control the height and shape of solder interconnects employed in electronic packaging application. A solder joint model was built to investigate the temperature distribution in the joint during the whole induction heating process by ANSYS software. Based on the simulation,...
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