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We proposed a hexagonal-rod growth behavior to describe the growth mechanism of the intermetallic Cu6Sn5 phase inside the liquid Sn-base solder. We found that the interfacial Cu6Sn5 phase formed on Sn/Cu joint interface also has the similar characteristics in terms of the shapes and surface textures. Based on this anisotropic growth behavior, a supply-controlled kinetic model of Cu6Sn5 phase was established...
We proposed a hexagonal-rod growth behavior to describe the growth mechanism of the intermetallic Cu6Sn5 phase inside the liquid Sn-base solder. We found that the interfacial Cu6Sn5 phase formed on Sn/Cu joint interface also has the similar characteristics in terms of the shapes and surface textures. Based on this anisotropic growth behavior, a supply-controlled kinetic model of Cu6Sn5 phase was established...
Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/ polycrystalline Cu interface during solid-state aging. The results show that the interfacial Cu6Sn5 grains exhibit textured growth under solid-state condition and their preferred orientations are affected by the as-soldered joints. Cu6Sn5 grains with [0001] direction normal to the interface are stable in solid and molten Sn37Pb...
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