The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A new die attach material prepared by pressing micro-sized Sn-coated Ag powders as a preform is proposed for high-temperature power device packaging. The Sn-coated Ag powders were completely transformed into Ag3Sn with a melting point of 480°C after bonding at 250°C for 10 min, subsequently producing a bondline which can sustain a much higher temperature than the processing temperature. The detailed...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.