The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Power converter is going in the direction of the high power density. Aimed at the trend, a 1200V/300A planar double-side cooling IGBT module has been designed, packaged. Comparing with conventional IGBT module, Parasitic inductance is reduced by 43.26%; Thermal resistance is 26.7% lower; Turn-on time and turn-off time are decreased by 35% and 15.8% respectively; The total power losses are reduced...
In order to improve the heat dissipation performance of IGBT module, a new type of structure unit for Three-dimensional IGBT module packaging which can implement double-sided cooling has been built. In view of the traditional single-sided cooling structure unit of IGBT module and the new type of Three-dimensional structure unit in double-sided cooling IGBT module, a corresponding mathematical model...
Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively, improve the reliability in some special circumstance. In view of the special requirements of packaging process for double-sided cooling IGBT module, a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built, and...
Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively, improve the reliability in some special circumstance. In view of the special requirements of packaging process for double-sided cooling IGBT module, a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built, and...
In order to improve the heat dissipation performance of IGBT module, a new type of structure unit for Three-dimensional IGBT module packaging which can implement double-sided cooling has been built. In view of the traditional single-sided cooling structure unit of IGBT module and the new type of Three-dimensional structure unit in double-sided cooling IGBT module, a corresponding mathematical model...
Solder delamination is one of the main failure modes of IGBT module. When the severity of the failure mode is different, the temperature character of IGBT is also different. This paper presents a methodology based on 3D thermal-electro coupling finite elements modeling intended to analyze the relation between the failure degree and the temperature, The results suggest when the area of solder delamination...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.