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We have investigated effects of the oxygen doping into TaCx on the effective work function (Phim,eff) in TaCx/SiO2/Si and TaCx/HfO2/Si gate stacks. It has been found for the first time that the threshold voltage (Vth) is tunable within 0.5~0.6V for HfO2 MOSFETs by adjusting the oxygen content within 0~12 at. % in TaCx. Furthermore, it has been shown that unknown oxygen content in TaCx gates is a possible...
This paper describes the fabrication and performance of CMOS transistors featuring flash lamp annealing (FLA) for 45 nm node. We show, for the first time, applying FLA prior to spike RTA as S/D annealing is effective to enhance the channel stress in PFET with epitaxially grown SiGe (eSiGe) S/D. In NFET, FLA recovers the damaged layer in S/D extension caused by implantation and suppresses the transient...
We have found that, for Si dots individually charged with a few electrons or holes, characteristic potential profiles with a dimple around the center of the charged Si dot are observed and can be interpreted in terms of the Coulomb repulsion among the charges retained in the dot. By an introduction of Ge core in Si dots, holes can be well-confined in the Ge core while electrons are stored in the Si...
We found a new anomalous gate leakage current (AGLC) of ultra-thin gate-SiON, which may directly impact standby leakage and yield for 65 nm node and beyond. We have identified the AGLC mechanism and also developed gate-stack fabrication process as effective countermeasures. Reducing gate-SiON to less than 1.3 nm induces AGLC leading to reliability degradation in nFET. With relatively large Phosphorous...
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