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We show the positive impact of differential driving on the optical QPSK signal performance. For the first time, an EVM of <6% at 32 GBd QPSK has been achieved for a low power InP-IQM design, enabling small form factor transmitters.
High speed InP-based travelling wave electrode (TWE) Mach-Zehnder modulators are presented and their integration capabilities to fabricate next generations of compact and high capacity transmitter components by utilizing so-called “monolithic-on-hybrid” integration approaches are emphasized.
The state-of-the art of medium and large scale InP-based Mach-Zehnder modulator PIC development is reported with regard to commercial fabrication of advanced transmitter components.
Development and characterization of monolithic, flip-chip compatible 2×50 Gb/s twin-IQ DQPSK MZ modulator chips - capable for hybrid assembly onto planar optical boards of advanced Tbit-capacity transmitter modules - is reported for the first time.
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