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Inductive charging is a promising option for electric vehicle (EV) recharging. It has the advantage of safety, convenience, and durability [1]. The idea of inductive charging is to transfer power to a stopped or moving vehicle across an airgap without physical contact between the vehicle and the grid.
Sn-Ag-Cu solders have been widely used as lead-free candidates for the Ball-Grid-Array (BGA) interconnection in the microelectronic packaging industry. However, widely used Sn-Ag-Cu solders such as with 3.0–4.0 wt% Ag in microelectronics exhibit significantly poorer reliability than SnPb solder. For the improvement of the problem by SAC solder alloys, the IMC control at the interface are needed. In...
The influences of intermixing nano-Ti02 particles on the wettability and interfacial reaction of novel lead-free Sn3.5Ago.5Zn composite solder with Cu substrate were investigated. The wettability of the Sn3.5Ag0.5Zn composite solder alloy was measured by the sessile-drop method under a 10−3 Torr vacuum at different temperature up to 30 mins. Scanning electron microscopy (SEM) was used to quantify...
Temperature dependent activation energy (Ea) has been observed for backend low-κ (LK) and extreme LK (ELK) dielectric TDDB. We experimentally demonstrated that the charge transport through the LK/ELK is dominated by the Poole-Frenkel mechanism, even in the low E-field, and Cu-ion diffusion occurs at a later stage of stressing, which is more probable at high temperatures and in sub-65nm (40-28nm) technologies...
Wire bonding is one of the common interconnection technologies being used in industry. Requirements for numbers of wires increased, bond pad pitch was reduced in order to maintain in small die size, and higher requirement on the reliability of the wire bonding is required to withstand aggressive environments. Many use gold wire as the interconnect wires. Recently, people start to explore more on copper...
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